アプリケーションエンジニア

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Job details

Company overview

We are a company that develops and manufactures semiconductor manufacturing equipment and related precision processing technologies using advanced technologies. As a leading company in microfabrication technology, the company is highly regarded in a wide range of industrial fields, particularly in the semiconductor industry. Its products and technologies are indispensable in the manufacturing process of semiconductor devices, enabling high-precision processing and quality control. DISCO also has a global presence, providing innovative solutions to customers in Japan and overseas. We are committed to sustainable growth and social responsibility, and contribute to future industrial development through technological innovation.

Responsibilities

• 半導体・電子部品製造における切断・研削・研磨工程で使用される、新規装置のプロセス開発をご担当頂きます。
• 数年以内の製品化を予定しているプロジェクトです。
• 開発テーマは複数あるため、適性やご希望に応じて取り組んでいただくことが可能です。

Requirements

必須要件：

• CMP、もしくは洗浄工程におけるプロセスに関する経験、知見をお持ちの方

歓迎要件：

• 顧客折衝経験

Salary

6 - 10 million yen

Location

Tokyo