Advanced Technology Japan Engineer, WoW Bonding

---

Job details

Company overview

We are a multinational semiconductor manufacturer headquartered overseas. We develop and manufacture memory products and storage solutions. Using advanced technology and innovation, we provide products for a wide range of applications including data centers, mobile and embedded systems. We also focus on improving energy efficiency and performance to help realize a sustainable society. By developing customized services to meet customer needs and providing high-quality, reliable solutions, we have earned a solid reputation worldwide.

Responsibilities

As a Wafer Bonding Process Engineer in ATE (Advanced Technology Engineering) department, you will be responsible for introducing, ramping up, and optimizing next-generation technologies. Your role includes evaluating state-of-the-art equipment, developing and improving processes, driving yield enhancement, cost reduction, and productivity improvement initiatives. You will collaborate with global teams such as R&D, other sites, and various suppliers to resolve technical challenges.In this position, you will utilize methodologies such as DOE, SPC and FMEA to ensure process reliability and contribute to achieving goals in quality, cost, and risk management.
Main responsibilities:

• Development and Optimization of Wafer Bonding Processes
• Integrated Optimization of Wafer Bonding, Si Grinding, and Bevel Trimming
• Equipment Evaluation, Installation, and Upgrades
• Set up new equipment, perform performance evaluations, and stabilize processes
• Conduct technical discussions with equipment vendors and propose specification improvements
• Quality and Yield Improvement Activities
• Implement SPC metrics, perform abnormality analysis, and establish preventive measures
• Reduce risks using FMEA and 8D problem-solving methodologies
• Driving Technology Development Projects
• Develop processes for transitioning next-generation technologies to mass production
• Collaborate with global teams on joint research and standardization activities
• Coordinate with Material Suppliers for Quality, Cost, and Risk Management

ATE（Advanced Technology Engineering）部門におけるWafer Bondingプロセスエンジニアとして、次世代技術の導入・立ち上げ・最適化を担当します。最新鋭装置評価、プロセス開発及び改善、歩留まり向上、コスト削減、生産性改善に関する活動を推進し、RnD、他サイト、各種Supplierなどのグローバルチームと連携して技術課題を解決します。本ポジションでは、DOE/SPC/FMEAなどの手法を用いてプロセスの信頼性を確保し、品質・コスト・リスク管理の目標達成に貢献します。
業務内容：

• Wafer Bondingプロセスの開発・最適化
• Wafer Bonding、Si Grinding、Bevel Trimmingの統合最適化
• 装置評価・導入・アップグレード
• 新規装置のセットアップ、性能評価、プロセス安定化
• 装置メーカーとの技術協議、仕様改善提案
• 品質・歩留まり改善活動
• SPCメトリクス導入、異常解析、再発防止策策定
• FMEA、8D問題解決手法によるリスク低減
• 技術開発プロジェクトの推進
• 次世代技術の量産移行に向けたプロセス開発
• グローバルチームとの共同研究、標準化活動
• 材料サプライヤーとの連携による品質・コスト・リスク管理

Requirements

Minimum requirements:

• Practical experience in Wafer Bonding, Si Grinding, and Bevel Trimming
• In-depth knowledge of semiconductor packaging technologies
• Hands-on experience with quality improvement methodologies such as DOE, SPC, and FMEA
• Ability to communicate technical information effectively in English (for collaboration with global teams)
• Proficiency in Microsoft Office (Excel, Word, PowerPoint)

Preferred qualifications:

• Experience with CMP and 3D integration technologies
• Skills in data analysis and automation using LabVIEW, FPGA control, Python, or MATLAB
• Experience in project leadership and participation in standardization activities
• Japanese language proficiency at a conversational level.

Salary

6 - 10 million yen

Location

Hiroshima