Wafer Bonding Process Engineer｜ウエハ接合プロセスエンジニア

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Job details

Company overview

We are a multinational semiconductor manufacturer headquartered overseas. We develop and manufacture memory products and storage solutions. Using advanced technology and innovation, we provide products for a wide range of applications including data centers, mobile and embedded systems. We also focus on improving energy efficiency and performance to help realize a sustainable society. By developing customized services to meet customer needs and providing high-quality, reliable solutions, we have earned a solid reputation worldwide.

Responsibilities

Wafer Bondingプロセスの開発・改善をお任せします。
新規設備評価、工程最適化、歩留まり・生産性向上、コスト削減を推進し、グローバルチームと連携して技術課題を解決し、DOE/SPC/FMEAを活用した品質・工程管理にも従事いただきます。 
■職務内容

• Development and Optimization of Wafer Bonding Processes
• Integrated Optimization of Wafer Bonding, Si Grinding, and Bevel Trimming
• Equipment Evaluation, Installation, and Upgrades
• Set up new equipment, perform performance evaluations, and stabilize processes
• Conduct technical discussions with equipment vendors and propose specification improvements
• Quality and Yield Improvement Activities
• Implement SPC metrics, perform abnormality analysis, and establish preventive measures
• Reduce risks using FMEA and 8D problem-solving methodologies
• Driving Technology Development Projects
• Develop processes for transitioning next-generation technologies to mass production
• Collaborate with global teams on joint research and standardization activities
• Coordinate with Material Suppliers for Quality, Cost, and Risk Management

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Requirements

■Minimum requirements

• Practical experience in Wafer Bonding, Si Grinding, and Bevel Trimming
• In-depth knowledge of semiconductor packaging technologies
• Hands-on experience with quality improvement methodologies such as DOE, SPC, and FMEA
• Ability to communicate technical information effectively in English (for collaboration with global teams)
• Proficiency in Microsoft Office (Excel, Word, PowerPoint)

■Preferred qualifications

• Experience with CMP and 3D integration technologies
• Skills in data analysis and automation using LabVIEW, FPGA control, Python, or MATLAB
• Experience in project leadership and participation in standardization activities

Salary

6 - 10 million yen

Location

Hiroshima