• Job number: Job-00265264 Posted: 2024-05-20

  半導体製造装置の振動解析エンジニア

  トップシェア半導体製造装置メーカー

  8 - 14 million yen Tokyo Industrial CAE / CFD / EMC

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  Company overview

  We are a company that develops and manufactures semiconductor manufacturing equipment and related precision processing technologies using advanced technologies. As a leading company in microfabrication technology, the company is highly regarded in a wide range of industrial fields, particularly in the semiconductor industry. Its products and technologies are indispensable in the manufacturing process of semiconductor devices, enabling high-precision processing and quality control. DISCO also has a global presence, providing innovative solutions to customers in Japan and overseas. We are committed to sustainable growth and social responsibility, and contribute to future industrial development through technological innovation.

  Responsibilities

  半導体製造装置の振動解析に関する以下業務をご担当いただきます。
  業務内容：
  装置の機械的振動の解析（実験、CAEによる解析、改善）
  改善提案および構造開発
  トラブル対応
  開発プロセスを効率化するための計算や設備などのツール開発
  

  

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