チップ設計開発

---

Job details

Company overview

We are one of the world's leading flash memory manufacturers. The flash memory we have invented is a non-volatile semiconductor memory that does not lose data even when the power is turned off, enabling large-capacity data storage. It is widely used in smartphones for storing photos and videos, electronic devices, and data centers, etc. In order to cope with increasing data due to the spread of IoT, AI, and 5G, large-capacity, high-performance storage and high-speed data processing systems are essential. As a leading flash memory and SSD company, we are developing products and services that provide new value. Our engineers with diverse expertise pursue next-generation recording technologies, and we also promote open innovation in cooperation with companies and organizations. We have one of the world's largest flash memory factories, and our AI-based smart factory achieves high productivity and efficiency to meet the increasing demand for memory.

Responsibilities

• AI市場の爆発的成長に伴い、さらなる高速化・低消費電力化が求められる次世代3次元フラッシュメモリのチップ設計開発を主導いただきます。
• 特に、外部コントローラとのインターフェース部からチップ内部の高速データ転送を担うデータパス回路まで、チップ全体の性能を決定づける最重要ブロックのアナログ・デジタル混在回路設計・検証が主戦場となります。

Requirements

必須条件：

• TOEIC(R)600点以上もしくは英語を使った業務経験を有し、以下いずれかの経験を最低5年以上経験している方　※メモリ開発経験者歓迎
  • Flash Memoryの回路設計業務(アナログ回路・デジタル回路・ゲートレベルでの回路設計問わず)
  • 高速Interface回路設計業務(特にDRAMのDDR4/LPDDR4以降の回路設計経験)

歓迎条件：

• Flash Memory開発業務経験
• DDR5/LPDDR5/LPDDR5X/GDDR6の開発経験

Salary

5.5 - 12.6 million yen

Location

Kanagawa