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Job number: JN -052025-188635 Posted: 2025-05-27

Field Service Engineer (Semiconductor Manufacturing Equipment)

A focus on continuous development & employee well-being
7 - 10 million yen Osaka Industrial Field Service Engineer

Job details

Company overview
We are a leading global company that materializes and provides cutting-edge science as products and services. We specialize in the field of science business, where we observe matter at the scale of molecules and atoms. We bring together core technologies in areas such as low temperature, high magnetic fields, ultra-high vacuum environments, nuclear magnetic resonance, X-ray, and electron/optical measurements.
Responsibilities
Main responsibilities:
  • Hardware setup and technical services for semiconductor manufacturing CVD deposition and etching equipment

業務内容:
  • 半導体製造CVD成膜及びエッチング装置のハードウェア立上げ・技術サービス業務
Requirements
Minimum requirements:
  • Experience in equipment launch in the semiconductor equipment market
  • Experience in hardware service for equipment (2 years or more)
  • Ability to interpret data on related hardware and process technology, such as electrical circuits related to the equipment and process chart flows, from equipment accompanying documents, etc. (essential)
  • Ability to understand software configuration for equipment UI PC skills: Word, Excel are essential
  • Ability to write technical documents English skills (reading manuals, email correspondence with headquarters, training in the UK, etc.)
  • Regular driver's license
  • Good communication skills with customers.
  • Team player.
  • High awareness of improvement and reform
Preferred qualifications:
  • Experience working on hardware at a semiconductor manufacturing plant (preferable)
  • Ability to interpret knowledge on related technologies, such as inspection methods, from accompanying manuals, etc. and execute as necessary (preferable)
  • TOEIC 450 points or higher is preferable.
  • Knowledge and experience of semiconductor deposition or etching equipment will be preferred.
必須要件:
  • 半導体装置市場における装置立ち上げ経験
  • 装置機器におけるハードウェアサービス対応の経験(2年以上)
  • 装置に関連する電気回路や、プロセスチャートフローなど、関連するハードウェア及びプロセス技術に関するデータを装置付帯ドキュメント等から読み解くことができること(必須)
  • 装置UIに対するソフトウェア構成を理解する力
  • PCスキル・・・Word, Excelは必須
  • 技術文章作成能力
  • 英語力(マニュアル読解、本社とのEメールやりとり、英国でのトレーニング等)
    • TOEIC 450点以上が望ましい。
  • 普通自動車運転免許
  • お客様との良好なコミュニケーション力
  • チームプレーヤー
  • 改善改革への高い意識
歓迎要件:
  • 検査方法など関連する技術に関する知見を付帯マニュアル等から読み解き、必要に応じて実行することができること(尚可)
  • 半導体製造工場においてハードウェア作業に従事した経験(尚可)
  • 半導体成膜又はエッチング装置知識及び経験を優遇
Salary
7 - 10 million yen
Location
Osaka
Emmeline Tang
BRS Consultant
Emmeline Tang
Electronics
Email me directly

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