Integration Engineer（Wafer Bonding Process）

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Job details

Company overview

The company is a technology company specializing in the development and manufacturing of semiconductor memory products. It provides a wide range of solutions for data centers, mobile devices, and automotive applications. It advances high-performance memory technologies through continuous innovation. It is committed to supporting the growth of the digital economy through foundational technologies.

Responsibilities

The Wafer Bonding Process Integration Engineer will be part of the future DRAM Technology Development and play a pivotal role in the industrialization of the new wafer bonding applications. The position provides expertise in Bonding processes. The job will involve the following functions.
Main responsibilities:

• Lead the implementation of Wafer Bonding integration processes, ensuring the best performance and reliability.
• Work cross-functionally to define integration requirements and establish best practices for wafer bonding technologies according to product requirement.
• Drive innovation in wafer bonding methodologies, benchmark/evaluate new bonding technologies / solutions and stay updated on industry innovations and state-of-the-art techniques.
• Provide technical leadership and mentorship to junior engineers
• Conduct deep dive analyses and troubleshooting of wafer bonding integration issues, leading and implementing corrective actions as necessary.
• Collaborate with Process teams in US to transition and setting up.

Requirements

Minimum requirements:

• Master’s Degree or equivalent experience in Electrical engineering, Semiconductor Device Technology, Physics, or related field.
• Minimum of 10 years of the industry experience, with 3-5 years in Wafer Bonding technology.
• Expertise in Fusion Bonding is required.
• Knowledge in the use of statistical process control and analysis tools.
• Strong understanding of material characterization and analysis techniques relevant to wafer bonding.
• Strong analytical and problem-solving skills, both technical and interpersonal.
• Pragmatic and flexible attitude with a result- and data-driven can-do mentality.
• Excellent communication skills, written and verbal communication in English.
• Japanese communication desired, but not mandatory
• Ability to convey complex technical concepts to diverse audiences.

Salary

8 - 12 million yen

Location

Tokyo