Integration Engineer（Wafer Bonding Process）

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Job details

Company overview

We are a multinational semiconductor manufacturer headquartered overseas. We develop and manufacture memory products and storage solutions. Using advanced technology and innovation, we provide products for a wide range of applications including data centers, mobile and embedded systems. We also focus on improving energy efficiency and performance to help realize a sustainable society. By developing customized services to meet customer needs and providing high-quality, reliable solutions, we have earned a solid reputation worldwide.

Responsibilities

The Wafer Bonding Process Integration Engineer will be part of the future DRAM Technology Development and play a pivotal role in the industrialization of the new wafer bonding applications. The position provides expertise in Bonding processes. The job will involve the following functions.
Main responsibilities:

• Lead the implementation of Wafer Bonding integration processes, ensuring the best performance and reliability.
• Work cross-functionally to define integration requirements and establish best practices for wafer bonding technologies according to product requirement.
• Drive innovation in wafer bonding methodologies, benchmark/evaluate new bonding technologies / solutions and stay updated on industry innovations and state-of-the-art techniques.
• Provide technical leadership and mentorship to junior engineers
• Conduct deep dive analyses and troubleshooting of wafer bonding integration issues, leading and implementing corrective actions as necessary.
• Collaborate with Process teams in US to transition and setting up.

Requirements

Minimum requirements:

• Master’s Degree or equivalent experience in Electrical engineering, Semiconductor Device Technology, Physics, or related field.
• Minimum of 10 years of the industry experience, with 3-5 years in Wafer Bonding technology.
• Expertise in Fusion Bonding is required.
• Knowledge in the use of statistical process control and analysis tools.
• Strong understanding of material characterization and analysis techniques relevant to wafer bonding.
• Strong analytical and problem-solving skills, both technical and interpersonal.
• Pragmatic and flexible attitude with a result- and data-driven can-do mentality.
• Excellent communication skills, written and verbal communication in English.
• Japanese communication desired, but not mandatory
• Ability to convey complex technical concepts to diverse audiences.

Salary

8 - 12 million yen

Location

Tokyo