IC Design Service Director

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募集要項

会社概要

業務内容

Main responsibilities:

• To setup a chip implementation team including the man-power and expertises of front-end STA timing closure, DFT, low power design,  physical design, physical verification, etc.
• To do ASIC project engagements and pre-sale technical supports to customers in different regions, not limited to Japanese customers.
• To lead the chip implementation team and conduct RTL-to-GDSII or Netlist-to-GDSII design services, ensuring first-cut success, on-time delivery and continuous productivity improvement.
• To collaborate with cross-functional teams, including IP design, RTL design and Package/Testing/Product engineers, etc., to ensure seamless integration of ASIC designs into overall product developments.
• To leverage the existing design methodology and shorten the new team's learning curve to start ASIC chip implementation as early.
• To mentor and develop team members, fostering a culture of continuous learning and professional growth.

応募条件

Minimum requirements:

• Bachelor's, Master's, or Ph.D. in Electrical Engineering or related field.
• Over 20 years of experience in IC design, with a focus on ASIC development at 7nm/5nm or above.
• Proven experience in a leadership role, managing teams through the entire IC design life cycle.
• Expertise in leading-edge semiconductor technologies and EDA tools/flows.
• Strong domain knowledge at HPC, AI accelerator, Networking, SSD, or consumer ASIC designs.
• Good communication in English.

Preferred qualifications:

• Familiar with Advanced Package Technology is a plus.

給与

1500 - 2500 万円

勤務地

関西