Advanced Technology Japan Engineer, CMP Process.

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募集要項

会社概要

同社は本社を海外に持つ多国籍半導体メーカーです。メモリ製品およびストレージソリューションの開発と製造を手掛けています。高度な技術と革新を駆使し、データセンター、モバイル、組み込みシステムなど、幅広い用途に対応する製品を提供しています。また、エネルギー効率や性能向上に注力し、持続可能な社会の実現に貢献しています。顧客のニーズに応じたカスタマイズサービスを展開し、高品質で信頼性のあるソリューションを提供することで、世界中で高い評価を得ています。

業務内容

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As a CMP Process Engineer in ATE (Advanced Technology Engineering) department, you will be responsible for introducing, ramping up, and optimizing next-generation technologies.
Your role includes evaluating state-of-the-art equipment, developing and improving processes, driving yield enhancement, cost reduction, and productivity improvement initiatives.
You will collaborate with global teams such as R&D, other sites, and various suppliers to resolve technical challenges.
In this position, you will utilize methodologies such as DOE, SPC and FMEA to ensure process reliability and contribute to achieving goals in quality, cost, and risk management.

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■Responsibilities

• Development and Optimization of CMP Processes
• Integrated Optimization of CMP
• Equipment Evaluation, Installation, and Upgrades
• Set up new equipment, perform performance evaluations, and stabilize processes
• Conduct technical discussions with equipment vendors and propose specification improvements
• Quality and Yield Improvement Activities
• Implement SPC metrics, perform abnormality analysis, and establish preventive measures
• Reduce risks using FMEA and 8D problem-solving methodologies
• Driving Technology Development Projects
• Develop processes for transitioning next-generation technologies to mass production
• Collaborate with global teams on joint research and standardization activities
• Coordinate with Material Suppliers for Quality, Cost, and Risk Management

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応募条件

■Must have

• Practical experience in CMP
• In-depth knowledge of semiconductor packaging technologies
• Hands-on experience with quality improvement methodologies such as DOE, SPC, and FMEA
• Ability to communicate technical information effectively in English (for collaboration with global teams)
• Proficiency in Microsoft Office (Excel, Word, PowerPoint)
• English skills: Business level
• Japanese: skills: Native or fluent

■Nice to have

• Experience with CMP and 3D integration technologies
• Skills in data analysis and automation using LabVIEW, FPGA control, Python, or MATLAB
• Experience in project leadership and participation in standardization activities

給与

700 - 1400 万円

勤務地

広島