Advanced Technology Japan Engineer, CMP Process.

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Job details

Company overview

We are a multinational semiconductor manufacturer headquartered overseas. We develop and manufacture memory products and storage solutions. Using advanced technology and innovation, we provide products for a wide range of applications including data centers, mobile and embedded systems. We also focus on improving energy efficiency and performance to help realize a sustainable society. By developing customized services to meet customer needs and providing high-quality, reliable solutions, we have earned a solid reputation worldwide.

Responsibilities

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As a CMP Process Engineer in ATE (Advanced Technology Engineering) department, you will be responsible for introducing, ramping up, and optimizing next-generation technologies.
Your role includes evaluating state-of-the-art equipment, developing and improving processes, driving yield enhancement, cost reduction, and productivity improvement initiatives.
You will collaborate with global teams such as R&D, other sites, and various suppliers to resolve technical challenges.
In this position, you will utilize methodologies such as DOE, SPC and FMEA to ensure process reliability and contribute to achieving goals in quality, cost, and risk management.

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■Responsibilities

• Development and Optimization of CMP Processes
• Integrated Optimization of CMP
• Equipment Evaluation, Installation, and Upgrades
• Set up new equipment, perform performance evaluations, and stabilize processes
• Conduct technical discussions with equipment vendors and propose specification improvements
• Quality and Yield Improvement Activities
• Implement SPC metrics, perform abnormality analysis, and establish preventive measures
• Reduce risks using FMEA and 8D problem-solving methodologies
• Driving Technology Development Projects
• Develop processes for transitioning next-generation technologies to mass production
• Collaborate with global teams on joint research and standardization activities
• Coordinate with Material Suppliers for Quality, Cost, and Risk Management

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Requirements

■Must have

• Practical experience in CMP
• In-depth knowledge of semiconductor packaging technologies
• Hands-on experience with quality improvement methodologies such as DOE, SPC, and FMEA
• Ability to communicate technical information effectively in English (for collaboration with global teams)
• Proficiency in Microsoft Office (Excel, Word, PowerPoint)
• English skills: Business level
• Japanese: skills: Native or fluent

■Nice to have

• Experience with CMP and 3D integration technologies
• Skills in data analysis and automation using LabVIEW, FPGA control, Python, or MATLAB
• Experience in project leadership and participation in standardization activities

Salary

7 - 14 million yen

Location

Hiroshima