【栃木】半導体パッケージ材料開発／評価解析や絶縁膜材料の開発

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Job details

Company overview

We are a company that manufactures and sells functional materials. Initially, we began with the production of circuit copper foil products and industrial adhesive products. Today, we handle everything from material development to process technology and production equipment technology, essential for realizing cutting-edge electronics products. We continue to meet customer needs by offering unique, high-value products. We have also entered the environmental and new energy sectors, developing materials for solar cell junctions and LED-related materials. Our main products include anisotropic conductive films, industrial adhesives, and optical films. Our core technologies are material development, manufacturing process technology, molecular and functional design technology, and analysis and evaluation technology. By integrating these technologies, our products have gained high global market shares and are widely adopted by many electronics manufacturers.

Responsibilities

 業務概要： 主に、半導体パッケージ材料の研究開発・設計・評価解析をご担当いただきます。加えて、国内外の顧客とのコミュニケーションや、海外のジャーナル論文などから知見を獲得し、業務に反映していただく活動もございます。 
 業務詳細：

• 半導体パッケージの評価解析
• 半導体絶縁膜材料の開発
• 半導体接合評価方法の構築  

Requirements

 必須条件：下記いずれかの経験、知識、スキル

• 半導体パッケージ製造プロセスおよびそれに使用される材料課題を熟知していること
• 半導体パッケージに特有・必要不可欠なプロセスおよび材料特性や信頼性を踏まえた開発業務を遂行できること
• 半導体業界の顧客対応経験があること

Salary

5 - 7.5 million yen

Location

Other